Technical Details of Transistor Outline (TO) Packages

R&D capability

• RF Simulation

• Mechanical and Thermal Simulation

• Optical Simulation

We innovate for you

SCHOTT's launch of the first ever 10 Gbit/TO PLUS® header marked one of the most significant breakthroughs in the history of high-speed design. Since then, SCHOTT has proactively supported the requirement for continuously increasing data rates by developing the next generation of high-speed products before the market demands it.

Platform developments – made to be customized

Our R&D specialists utilize their experience and market knowledge to anticipate future customer challenges and develop solutions for these potential problems before they occur. All of SCHOTT's high-performance TO header platforms are made to be modified to suit customer specifications. Typical modifications include size alterations, pin number, pin positioning and special material requirements.

We innovate with you

You can count on complete and comprehensive support from SCHOTT in your product design and development process. By working closely together, we can make sure your desired functionality and performance specifications are met. SCHOTT can help make customer designs a reality thanks to a broad base of available tools.

Local application support

We strongly believe in consulting with our customers on the best possible solutions that perfectly fit their individual requirements. As a member of the SCHOTT Group, we benefit from a large range of in-house process know-how, including glass development, melting, and processing. Our Electronic Packaging business is built on the additional knowledge of metal processing, plating and finishing. SCHOTT's TO specialists aim to utilize our international set-up and technological expertise to provide customers with the best application support and consult with you with regards to product customization requirements.

Sales support worldwide

"If you have a headache, you can call us around the corner." This is the motto that applies to all of our sales experts around the world. Our dedicated Electronic Packaging competence centers in Asia, Europe, and the US enable us to provide our customers with fast, local, and competent customer service. The SCHOTT Group as a whole offers global customer support through its production locations and sales offices in 35 countries.

Our innovation track record - The basis for current and next generation high-speed designs.

Recognized as a world leader in glass science and processing, SCHOTT’s development of specialty glasses for the permanent sealing of glass and metal dates back to the 1930s. The first generation of today‘s high-speed TO PLUS® headers were introduced in 1964. With more than 50 years of research and applied knowledge in the TO field, SCHOTT continues to be a leading force in designing and manufacturing innovative high-speed designs that support next-generation data and telecom infrastructure.

• 2018  50G: Breakthrough in Transistor Outline Technology. SCHOTT Introduces 50G TO PLUS® for unprecedented speed in datacom applications. 

• 2017  Overcoming all distances with high-speed TO solutions. High-performance TO headers and caps from SCHOTT can replace box packages in long-, middle-, and even short-range data transmission.

• 2016 Replacing box packages with SCHOTT 10G DML TEC TOs. Realizing new high-speed optical component designs with high-performance TO PLUS® headers and caps. SCHOTT introduces miniature TO38 and TO33 header outlines for QSFP transceivers to support 4x10 Gbit/s.

• 2015 Thinking outside the box: the new SCHOTT® TEC TO package. Ideal for 10Gbit/s cooled devices. 

• 2013 A quantum leap in high-speed designs: 28G TO PLUS® headers. 28G TO PLUS® headers are the first and only glass-to-metal sealed TO headers that enable data transmission rates of 28 GBit/s.

• 2012 Improved SCHOTT TO56 Ball Lens Caps. With the introduction of further improved TO56 Ball Lens Caps, SCHOTT offers an optimized, high-performance product specially developed for the Fiber-To-The-Home (FTTH) market.

• 2008 A quantum leap in high-speed designs. Development of the 14 Gbit/s TO PLUS® header for next-generation fiber channel.

• 2006 TO headers with superior heat conductivity. SCHOTT launches its TO38, TO39, and TO56 headers with copper heatsink for high heat conductivity products.

• 2002 First High-Speed TO Header for 10 Gbit/s. The 2002 introduction of the first high-speed TO PLUS® header for data rates of 10 Gbit/s marks a milestone in the history of SCHOTT‘s high-speed track record.

• 2000 High-Precision Angled Window Caps for VCSEL With increasing requirements for speed and optical accuracy, SCHOTT introduces high-precision Angled Window Caps for VCSEL applications to provide defined back reflection for monitoring.

• 1990 The triumph of fiber optic network deployment leads to TO headers and caps becoming standard equipment used to protect laser and photo diode chips. SCHOTT supports the need for increasing data rates by developing the next generation of high-speed products ahead of market demand.

• 1980 TO Can packages become more sophisticated when their main application switches to optoelectronics. Using in-house competency in optical glasses, SCHOTT begins to offer TO window and lens caps that are now required to transmit optical signals.

• 1964 Origins of high-volume transistor package production: SCHOTT EP is there from the beginning with the start of production of first hermetic TO headers based on glass-to-metal sealing.