Square semiconductor chip in the middle of a circuit board

Driving the semicon revolution

Our true passion for glass is sparked by imagination and fueled by expertise.

The future of semiconductors is empowered by glass

In the era of digitalization and AI, these megatrends are pushing the boundaries of technology. Today’s world runs on computing power. Applications like HPC/AI, autonomous driving, satellite communications, advanced mobile technology, medical diagnostics, and IoT are driving the need for innovative redesigns of IC packages. Advancing the pace of Moore’s Law is only possible with new materials. High-tech glass will play a vital role in keeping the pace for the semiconductor industry and enabling major trends like AI. With a proven track record in delivering mind-blowing glass types for more than 140 years, SCHOTT collaborates on ambitious IC packaging by enabling high-density interconnects at both wafer and panel levels. Discover our broad portfolio of semicon-grade flat glass solutions designed for permanent and temporary applications in semiconductor devices and processes and get in touch with us to make a difference - even in your most challenging projects.

Precisely performing glass solutions

SCHOTT offers high-end glass panels and wafers with a wide variety of thermal, mechanical, and electrical properties, all adhering to SEMI industry quality standards. Our extensive range of glass types and thicknesses, combined with outstanding bulk and surface quality, positions SCHOTT as a preferred supplier. We deliver scalable, high-quality solutions tailored to the needs of the semiconductor industry, ensuring reliability and efficiency in every application.

Illustration of a blue computer chip in the centre of a circuit board

Leading the ways of technological progress

At SCHOTT, our passion for discovery drives us to push technological boundaries. Our innovative glass solutions support groundbreaking projects that improve lives and industries worldwide. As a trusted partner, we provide the highest quality materials and expertise to ensure the success of your ambitious semiconductor projects, transforming challenges into innovation. Together, we are shaping the future of technology.

Solutions for the advancing semiconductor field

Carrier wafers and carrier panels: precision in processing

Glass carrier wafers streamline processes such as 3D IC packaging, wafer thinning, and fan-out wafer-level packaging (FO-WLP). With wide thermal expansion rates, mechanical and chemical robustness, high transmission, and geometric accuracy, SCHOTT glass wafers and panels are the preferred choice for both front-end and back-end packaging processes. These wafers offer transparency, ensuring precise alignment and handling during production.

Glass panels: best choice for heterogeneous packaging

IC substrates and interposers utilizing glass instead of polymer or silicon are vital for high-density interconnection of chips and passive components. SCHOTT glass panels, with variable thermal expansion (CTE) properties, offer excellent thermal and chemical resistance, making them ideal for microstructuring and metallization. Their high raw glass quality and broad CTE range support superior processing performance and accuracy.

Stack of thin glass panels on a dark background

Versatile glass solutions for high-tech applications

SCHOTT offers a range of materials with exceptional properties, catering to diverse high-tech applications. Our core portfolio supports thicknesses ranging from below 200 µm to several millimeters, with CTEs (Coefficient of Thermal Expansion) between 3 and 10 ppm/K and capabilities beyond based on our glass technologies. Featuring ultra-low total thickness variation (TTV) as low as < 0.5 µm for advanced applications and smooth surface quality with roughness less than 1 nm, SCHOTT glass ensures precise, reliable, and high-performance solutions for advanced semiconductor technologies.

Applications for the semiconductor industry

Illustration of circuit board with 6G computer chip in centre

Computing and telecommunication

SCHOTT Glass Panels support the integration of multiple chiplets and high-frequency components essential for high-performance computing and advanced telecommunication. These panels are ideal for data centers, AI, mobile communication, and IoT applications. They ensure optimized computing power, fast connectivity, and reliability, crucial elements in modern technology infrastructure.

Series of square semiconductors in circular array

Semiconductor packaging technologies

In semiconductor manufacturing, SCHOTT Glass Carrier Wafers and Panels facilitate precise optical inspections and reliable processes, aiding in wafer thinning and handling. These carriers enhance production efficiency and support sustainability through their reusability, reducing manufacturing costs.

Dr. Christian Leirer

We have established a new specialized division dedicated to advance our commitment to deliver customer-centric, tailored solutions and top-tier performance, empowering our partners in the semiconductor industry to achieve the best solutions.

The SCHOTT tradition of innovation in the semiconductor industry

Since its inception, SCHOTT has been at the forefront of materials science, continually pushing the boundaries of technology. Our recent advances in patterned glass wafers and an expanded portfolio of glass substrates are an example of this legacy. These innovations are revolutionizing chip packaging with improved performance and miniaturization, meeting the demanding requirements of the next generation of semiconductor technologies. Our pioneering spirit drives us to deliver innovative solutions that foster progress in the ever-evolving electronics industry. Discover more about our breakthroughs in the press releases linked below.

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