Passivation Glass
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Technical Details of Passivation Glass Frits

A vast selection of compositions – including lead-free options – means that SCHOTT Passivation Glass can be precisely matched with a diverse range of electrical components. Customers benefit from impressive insulation resistance thanks to our expert selection and processing of high-quality materials.

Finely tuned compositions for excellent component matching

Excellent insulation resistance

SCHOTT achieves high insulation resistance for its passivation glass frit by using material with very low alkali content, especially from sodium. This is achieved by sourcing the finest raw materials and using specialist production processes.

Thermal expansion matching

Our choice of compositions enables the glass’s coefficient of thermal expansion to perfectly match the semiconductor components. Varying compositions feature combinations of zinc, lead, silicate, and borate, while lead-free powders can also contain bismuth.

Lead-free glass types

SCHOTT Passivation Glasses can be offered as lead-free solutions for all common passivation applications.

Broad choice of high-quality glasses

Large assortment of high-purity glass types with standard particle size distributions and grain sizes as well as custom-made passivation glass formulations available.
Specifications
Technology

Specifications

Passivation glasses are offered in a variety of individual specifications due to diversified glass systems. All passivation glasses are supplied as glass powder and available in different grain sizes.

Glass No.  Typ Main applications α(20/300)  10-6/K Tg °C Pb-contents wt% Firing temp. in °C Holding Time Min.  Tj °C Layer thickness µm 
Lead-containing
G018-205 Pb-Zn-B sinter glass diodes  4.45 632 1-5  690 10  -  -
G017-388 

Zn-B-Si composite

thyristors, high-

blocking rectifiers


 3.6 550  1-5  700 5 180   ≥ 30
G017-002  Zn-B-Si composite  sinter glass diodes  3.7  545  1-5  700 10  180  -
G017-096R  Pb-B-Si 

sinter glass,

planar- and

mesa-diodes

 4.8 456 10-50  680  5  160  - 
G017-004 

Pb-B-Si

composite

 mesa diodes  4.1 440   10-50 740  5 160   ≥ 30
G017-230

Pb-B-Si

composite 

 transistors  4.2   440  10-50 700  4 160   ≥ 25
G017-725  Pb-B-Si   sinter glass diodes 4.9 468  10-50  670  10  180  - 
G017-997 

Pb-B-Si

composite 

 

wafer

passivation

 4.4 485  10-50 760 20  180  -
G018-133 

Pb-B-Si

composite 

  		 sinter glass diodes  4.8  463  10-50  690  30 - - 
 Lead-free
G018-200  Zn-B-Si  sinter glass diodes  4.6 557  -  665 10  - - 
G018-197 Zn-B-Si  sinter glass diodes  4.4  557  -  675  10  -  - 
G018-255  Bi-Zn-B  varistors  9.4  396  - 520  15  -  - 
G018-434  Zn-B-Si  sinter glass diodes
 4.1  563  - 680  20  -  > 25

 

Technology

Passivation glass powders are manufactured in two steps:

  1. The raw glass is first melted in specially designed aggregates.
  2. The glass ribbons are ground into fine powders of different grain size distribution.

Customers process our passivation glass powders in different ways. For the manufacturing of sintered glass diodes, a slurry of glass powder and deionized water is applied to the diode body before sintering it in a furnace. For wafer passivation, an organic suspension is applied by spinning, doctor blading, sedimentation, electrophoresis, or screen printing.

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Whether you need more information, samples, a quote, or advice for a project, I would be delighted to talk to you.

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Weston Wright

Product Sales Manager